NAND-based storage gadgets are a fiercely contested sector, one wherein Samsung has held the lead since 2002, however its rivals are gaining floor.
The South Korean electronics large has introduced plans to begin mass manufacturing of its latest 290-layer ninth-generation vertical (V9) NAND chips, geared toward AI and cloud gadgets in addition to large-scale enterprise servers. These make the most of Samsung’s double-stack know-how, somewhat than the triple stack methodology sometimes used.
Different companies are closing in, nevertheless. SK Hynix, the world’s second-largest reminiscence chipmaker and Samsung’s archrival, intends to launch its 321-layer NAND tech early subsequent 12 months, whereas Chinese language flash reminiscence specialist Yangtze Reminiscence Applied sciences says it plans to introduce 300-layer chips later this 12 months.
A recreation of rooster
With the battle heating up, Samsung is already trying past the upcoming V9 launch, with business insiders indicating {that a} staggering 430-layer tenth-generation (V10) NAND chip is predicted to be unveiled subsequent 12 months. Not like the V9, this may use Samsung’s triple-stack know-how.
The aggressive push for NAND supremacy comes as demand for high-performance and large-capacity storage gadgets grows within the AI period. Excessive-density NAND chips reply that demand whereas additionally enhancing capabilities for 5G smartphones.
The Korea Financial Every day says the key chipmakers are actually “engaged in a recreation of rooster in a race to develop superior chip stacking know-how to chop prices and enhance efficiency.” It factors out that Samsung has beforehand introduced plans to develop over 1,000-layer NAND chips by 2030.